Why take chances with your PV job setups when a winning alternative is available?
By Richard Yan Are you interested in optimizing your integrated circuit (IC) physical verification (PV) flows? How does automating the...
Why take chances with your PV job setups when a winning alternative is available?
雲端 EDA – 更勝以往
How Siemens EDA is using the TSMC 3Dblox standard to change 3DIC verification
The secret superpower of early design verification
使用 Calibre 顛覆 IC 設計流程
開始前須知:將以 GDS 為基礎的流程轉換為 OASIS
使用系統技術協同最佳化 (STCO) 方法,進行 2.5/3D 異質半導體整合
3D IC 異質組裝的系統層級連線關係之管理與驗證
進行正確連接:在 3D-IC 中管理系統層級 netlist 及其例外狀況