top of page


PCB simulation solutions for high-performance designs

HyperLynx is a complete family of analysis tools for high-speed electronic design including electrical design rule checking (DRC/ERC), signal integrity (SI), power integrity (PI) with integrated 2D/2.5D/3D electromagnetic modeling (3D EM). HyperLynx lets you discover and correct problems earlier in your design cycle using advanced simulation techniques to predict how your design will behave. Pre-route design simulation lets you explore alternatives to make informed design decisions, while post-route verification lets you perform detailed sign-off analysis before committing a design to fabrication. Increase your chance of first-pass design success to using HyperLynx to optimize your design’s performance and reliability.
HyperLynx is industry-renowned for ease of use, with automated workflows that make sophisticated analysis accessible to designers new to power and signal integrity. HyperLynx is integrated tightly with Mentor’s Xpedition and PADS Professional flows and also works with all major PCB layout systems.


From analyzing to realizing, you can design, simulate, and analyze mixed-technology circuits with PADS® Analog/Mixed-Signal (AMS) cloud-based and desktop solutions.

HyperLynx®設計規則檢查(DRC)為所有PCB佈局人員,硬件工程師和SI / PI / EMC專家提供快速,全面的電氣設計驗證,不限制佈局工具。
其自動化方法可以迭代使用,以識別導致信號完整性,電源完整性和EMI / EMC問題的設計違規,消除手動檢查和PCB循環瓶頸。


Accurately model power distribution networks and noise propagation mechanisms throughout the PCB design process

Identify potential power integrity distribution issues that can interfere with board design logic, and investigate and validate solutions in an easy-to-use, “what-if” environment with HyperLynx® PI.
This intuitive tool gives any member of your design team the ability to quickly and accurately analyze power integrity, without the usual steep learning curve of most power analysis products.
Design team access to these sophisticated power integrity capabilities will help companies reduce prototype spins, shorten time to market, and allow engineers to develop more reliable products.


Analyze signal integrity issues early in the design cycle to eliminate costly re-spins

HyperLynx® Signal Integrity (SI) performs signal integrity analysis using automated workflows that make advanced analysis accessible to everyday PCB system designers. From pre-route design exploration and “what-if” analysis through detailed verification and sign-off to manufacturing, HyperLynx SI has you covered!
HyperLynx SI supports general-purpose SI, DDR interface signal integrity and timing analysis, power-aware analysis and compliance analysis for popular SerDes protocols, all with the fast, interactive analysis and ease of use and integration HyperLynx is known for. Want to reduce your design cycle and increase your chance of first-pass success with your next high-speed design? Use HyperLynx!


3D, broadband, full-wave electromagnetic field solver for SI, PI, and EMI

HyperLynx® Full-Wave Solver delivers unprecedented speed and capacity, through accelerated boundary element technology, while preserving gold-standard Maxwell accuracy. Achieve greater accuracy and fewer re-spins, even on the most complex structures.
Designers can take advantage of high speed, accuracy and capacity for signal integrity, power integrity and EMI concerns – all from within a common interface. The Full-Wave Solver is built from the ground up to exploit multi-core and hybrid architectures, and to utilize the best of fast solver technology to enable fast simulation on a single core or multiple cores.
Power-aware SI trace model extraction can be performed, as well as DC and AC power integrity analysis at the system (package/PCB) level. Designers can benefit from a power delivery network impedance profile, capacitor loop inductance, and combined signal and power broadband S-parameter extraction for use in time-domain simulation – all within a common, easy-to-use interface.


Accelerated, full-3D electro-magnetic-quasi-static (EMQS) extractor

HyperLynx® Fast 3D Solver enables efficient, full package model creation with multi-processing for faster turnaround time. It is ideally suited for power integrity, low-frequency SSN/SSO, and complete-system SPICE model generation while accounting for skin effect impact on resistance and inductance.
Fast solver technologies enable rapid simulation on single and multiple cores. It is 20x-100x faster than other equivalent solutions and maintains full-3D gold-standard EMQS accuracy. The intuitive GUI enables users working with the latest system-in-package (SiP), package-on-package (PoP), stacked die, and multi-chip module (MCM) scenarios to easily extract accurate models with minimum extraneous effort on boundary conditions and port definitions.
Whether the specific application is related to a high-performance microprocessor design, a low-cost ASIC and system design, power integrity, signal integrity, or simultaneous switching noise, effective solutions are available for all design types.

bottom of page