最新消息 | Enlight Technology 恩萊特科技

曲線來了！IC製造為曲線光罩做準備！

製造積體電路時，我們過去總是製作具有曼哈頓 (垂直、水平) 和45度邊的光罩。例如，即使實際印在晶圓上的形狀是圓的，接觸孔仍設計成方的。事實證明，要印出這種圓形，適當的光罩圖案實際上應當是圓形，即最終的製程視窗最大化曲線光罩形狀。現今多電子束光罩刻寫機使得光罩刻寫曲線圖形成...

搶攻光通訊商機 - 矽光子晶片設計，從元件、線路到系統

活動簡介在5G、AIoT、智慧電子及雲端運算等高數據速率(High Data Rate)應用帶動下，相關的產品需求都呈現強勁的成長，矽光子（Silicon Photonics）技術頻寬大、損耗低的特性，能夠提供很高的調變速率，足以應付運算產業高速傳輸的需求，且具備縮小模組...

2022 L-Edit 進階實務 Workshop 圓滿成功

本周一(11/14)的 L-Edit 進階實務 Workshop 2022，為恩萊特科技的客戶進行 L-Edit 環境架構以及相關功能的介紹。除了功能的操作之外，也透過實務案例針對 DRC Set Up、TDB Layout vs Layout...

“How-To” OptiInstrument — Automation of EXFO CTP-10 Equipment for Remote Testing

This video demonstrates the remote communication and control of EXFO CTP-10 to set its operating conditions to measure a device under...

“How-To” OptiInstrument — IL Measurement of 4-Ch DEMUX

This video demonstrates measuring remotely the intensity of 4-Ch DEMUX using a Broadband source hosted in EXFO LTB-8 equipment and...

Siemens partners with TSMC for 3nm product certifications and other technology milestones

Siemens Digital Industries Software today announced TSMC has certified a broad array of EDA solutions from Siemens Digital Industries...

3D IC verification requires a golden netlist that allows exceptions

Tarek Ramadan With current 3D IC packaging technologies, since the system-level netlist (the 3D IC design intent) drives system-level LVS...

What’s new in PADS Professional release VX.2.12

By Jim Martens The new VX.2.12 release of PADS Professional has improvements across the following areas: Array placement MCAD...

創新MEMS元件開發與應用趨勢

活動簡介 AIoT應用發展持續熱燒，激勵各種智慧終端對感測器(Sensor)的需求不斷攀升，而基於微機電系統(MEMS)技術的微型化感測器，更已廣泛為業界所採用，相關MEMS元件也持續演進，以滿足愈來愈多創新智慧應用的需求，諸如微型揚聲器(Micro...