By Michael White When you’re flying, it’s fun to look out the window and see clouds from “the other side.” When you’re running an IC design company, clouds take on a whole new perspective as well. Just like planes made it possible to cross continents and oceans in hours rather than days, EDA in the cloud can make it possible to get to tapeouts faster. But, just as we trust planes to carry us safely to our destinations, we also have to trust that running EDA software in the cl

Overview Starting L-Edit The L-Edit UI How to customize your environment Design Setup Masks and Layers Drawing Editing Cells and Hierarchy

MEMS Pro is a flexible, powerful, easy-to-use CAD tool suite for the design and analysis of micro-electro-mechanical systems (MEMS) and other types of sensors and actuators. It offers an integrated solution for the design process that shortens development time while providing designers reliable analysis for manufacture. Functionalities include mixed MEMS/IC schematic capture and simulation, full custom mask layout capability and verification, 3D model generation and visualiza

Using Tanner design tools, TOREX has developed the smallest converters possible without sacrificing functionality and performance. Nobuhiro Aoki, XCL Product Design Group, Product Development Depart, R&D HQ Introduction Tokyo-based TOREX Semiconductor (TOREX) specializes in the development of analog (CMOS) power integrated circuits (ICs). TOREX’s reputation for excellence is readily recognized as its best-in-class ICs achieve the optimum balance between size and cost. TOREX e

Siemens EDA IC 全流程 Siemens EDA 全流程有一個豐富的環境，高度可配置且非常靈活，為混合信號設計人員提供了許多易用功能。該流程經過優化，適用於創建 22nm 的定制模擬 IC 或 “類比為頂層” 的混合訊號 IC。它包含高度集成的前端和後端工具，從原理圖輸入到混合訊號模擬和波形檢索、查看及 RTL 網表綜合，再到佈局佈線、物理版圖實現以及晶圓廠認證的 Calibre® 平臺物理驗證。透過集成協力廠商工具支援互通性、多用戶和版本控制的Open Access 資料格式管控。該全流程套件有一個庫管理器，其為管理和流覽所有設計庫、單元和視圖提供一個統一的介面，並且提供對 IC Manage、Cliosoft 和 SubVersion (SVN) 版本控制軟體的支援。 工藝設計套件 (PDK) 是模擬和定制設計環境的一個重要組成部分，包括 OA 資料、CDF、回檔、網表程式和參數化單元 (PCell)。Siemens EDA 工藝包可以由協力廠商PDK轉換而來，包括回檔和 PCell 代碼。可擴展的自動化質檢流程可以確保Sieme

By Pradeep Thiagarajan Having done IC development for over two decades, I can appreciate the complexities of foundry processes that influence device modeling and silicon fabrication. Semiconductor physics continues to get pushed to newer limits with each technology progression to a smaller process geometry to achieve better PPA (Power/Performance/Area). Chip developers are packing in more features to enhance the customer experience of the end product with focus on quality and

Introduction The adoption of high-density advanced packaging (HDAP) continues to grow for all kinds of end-user applications. 2.5D integrated circuit (IC) designs using interposers (silicon or organic) generally target high-end applications such as military, aerospace, and high-demand computing, while 3D fan-out packaging approaches like the TSMC integrated fan-out (InFO) package focus more on mass consumption consumer applications like cell phones (figure 1). In addition, al

Siemens has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs) for the foundry‘s 110-nanometer (nm) and 180-nm BCD technology platforms. Siemens Digital Industries Software today announced it has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs) for the foundry‘s 110-nanometer (nm) and 180-nm BCD technology platforms. The new PDKs for UMC, which is a leading semiconductor foundry fo

By Shelly Stalnaker Electronic design automation (EDA) grew out of the need to make it easier and faster to design and manufacture integrated circuits. Nothing has changed since then, except…everything has changed. Just a couple of decades ago, we were entering “unknown territory”—the sub-nanometer era. Today, foundries and design companies are exploring 1nm process nodes. In all that time, the EDA industry constantly expanded functionality to address new design and manufactu