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2026 矽光子產業論壇

CoolSem Technologies

共同創辦人暨商務長/Co-founder & CCO

演講題目/Presentation topic:

Cooling at the Core: Wafer-Level Thermal Integration for Next-Generation Photonics

Pieter Heersink

講師介紹/Speaker bio:


Pieter Heersink is Co-founder and Chief Commercial Officer of CoolSem Technologies, an Eindhoven-based deep-tech company developing wafer-level thermal integration technologies for semiconductor and photonic devices. 

At CoolSem, he is responsible for commercial strategy, strategic partnerships, funding and the development of application-focused collaborations across the semiconductor value chain. 

Pieter is an experienced entrepreneur and business developer with a background in technology commercialization, corporate consulting and startup acceleration. Before co-founding CoolSem, he founded and led technology ventures, worked with IG&H and Capgemini, and supported deep-tech startups as an advisor at HighTechXL. 

His current focus is connecting CoolSem’s material and process innovations with concrete industry challenges in optoelectronics, power electronics and, over the longer term, high-performance computing. 

He works closely with device manufacturers, foundries, packaging specialists and system companies to create joint validation projects that can demonstrate measurable improvements in thermal performance, reliability and energy efficiency.


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