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How to verify well layer connectivity with soft checks
By Terry Meeks In the landscape of modern IC chip verification, ensuring the connectivity from diffusion layers to well regions is...
Aug 6, 20244 min read


A new physical verification reporting solution smooths the on-time tapeout effort
By Richard Yan In the intricate world of system-on-chip (SoC) development, Physical Verification (PV) reports serve as vital checkpoints...
Jul 30, 20242 min read


Balancing performance vs. debuggability in LVS circuit verification
By Wael ElManhawy Circuit verification engineers face ever more challenges as semiconductor technology evolves towards smaller process...
Jul 23, 20243 min read


Speeding up early design rule checking with Calibre nmDRC Recon
By John Ferguson and Nermeen Hossam Chip designers are very aware of how time-consuming early design rule checking (DRC) can be. Not only that, but traditional DRC runs during initial design phases can flood you with errors that may be irrelevant at this early stage. Sorting through these is a massive drain on time that you don’t always have. So let’s talk about Calibre® nmDRC™ Recon, a tool that makes early design rule exploration faster and more efficient. What is Calibre n
Jul 16, 20243 min read


Automated analysis-based layout enhancements reduce power grid voltage drops during place & route: A case study with Google
By Jeff Wilson Power isn’t just a small factor in the IC design arena—it’s a cornerstone. Design teams work to hit the trifecta of power, performance, and area (PPA) targets that reflect the intended market and functionalities of their products. The journey from concept to physical implementation is one of precision and innovation, as these teams shape layouts that meet these stringent targets. But, as technology pushes into more advanced process nodes, striking a balance bet
Jul 9, 20243 min read


Accelerate IP design cycles and reduce costs with Calibre design stage verification
By Terry Meeks In the fast-paced world of semiconductor design, time is a critical asset. One way IC designers save time is to...
Jun 25, 20244 min read


Unraveling the 3DIC shift left strategy: Navigating the world of multi-dimensional ICs
By John Ferguson IC design’s evolution continues to push the boundaries of Moore’s law to new heights. One of the most intriguing...
Jun 11, 20245 min read


Mastering parasitic extraction at the 3 nm process node
By Dilan Heredia and Karen Chow Designing integrated circuits (ICs) for the 3 nm process node poses challenges never seen before. One of...
May 29, 20245 min read


Parasitic extraction technologies: Advanced node and 3D-IC design
By John McMillan Most IC designers adopt advanced process technology nodes to benefit from improved performance, density, and functionality while also reducing delays and power consumption through continuous dimensional scaling. The utilization of new device architectures like fin field-effect transistors (finFET), fully depleted silicon-on-insulator (FDSOI), and gate-all-around GAA transistors extends gate length scaling but also results in increased interactions between nei
May 14, 20243 min read
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