By David Wiens The demand for high-speed and efficient RF (Radio Frequency) PCB design has never been greater. With billions of IoT devices expected to come online in the coming years, the necessity for RF design capabilities supporting ultra-fast 5G speeds is becoming increasingly apparent. The 5G revolution: why extreme speed support is crucial Several factors are driving the demand for extreme 5G speed support in RF PCB design. These include: IoT: the Internet of Things is

By Jeff Wilson Power isn’t just a small factor in the IC design arena—it’s a cornerstone. Design teams work to hit the trifecta of power, performance, and area (PPA) targets that reflect the intended market and functionalities of their products. The journey from concept to physical implementation is one of precision and innovation, as these teams shape layouts that meet these stringent targets. But, as technology pushes into more advanced process nodes, striking a balance bet

By Terry Meeks In the fast-paced world of semiconductor design, time is a critical asset. One way IC designers save time is to...

By Jim Martens The demand for electronics with gigahertz wireless technology, as well as IoT consumer devices have both increased dramatically. This has resulted in the subsequent increase of RF circuitry on designs, which will only continue as we move into the future. The unique design requirements of RF designs An engineer recently told me that their design only had about 10% RF circuitry on it, but that 10% takes up 90% of their design time to complete! This is because RF

By John Ferguson IC design’s evolution continues to push the boundaries of Moore’s law to new heights. One of the most intriguing...

By Todd Westerhoff What is power integrity analysis? PCB power integrity analysis is the study of a PCB’s Power Delivery Network (PDN),...

By Dilan Heredia and Karen Chow Designing integrated circuits (ICs) for the 3 nm process node poses challenges never seen before. One of...

根據WSTS統計，24Q1全球半導體市場銷售值達1,377億美元，較上季(23Q4)衰退5.7%，較2023年同期(23Q1)成長15.2%；銷售量達2,184億顆，較上季(23Q4)衰退0.6%，較2023年同期(23Q1)衰退2.2%；ASP為0.631美元，較上季(2...

By John McMillan Most IC designers adopt advanced process technology nodes to benefit from improved performance, density, and functionality while also reducing delays and power consumption through continuous dimensional scaling. The utilization of new device architectures like fin field-effect transistors (finFET), fully depleted silicon-on-insulator (FDSOI), and gate-all-around GAA transistors extends gate length scaling but also results in increased interactions between nei