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Taking 2.5D/3DIC physical verification to the next level
Introduction The adoption of high-density advanced packaging (HDAP) continues to grow for all kinds of end-user applications. 2.5D integrated circuit (IC) designs using interposers (silicon or organic) generally target high-end applications such as military, aerospace, and high-demand computing, while 3D fan-out packaging approaches like the TSMC integrated fan-out (InFO) package focus more on mass consumption consumer applications like cell phones (figure 1). In addition, al
Mar 8, 20228 min read


Enhancing Resiliency in Manufacturing through Connected Platforms, Increased Visibility, and Process
By: Deb Geiger, VP Global Marketing, Aegis Software When it comes to manufacturing digitalization, many organizations know what they need...
Mar 1, 20224 min read


How do you do PCB Stackup Planning?
By Don Kost Planning for Signal Integrity Stackup planning is one of the most important but often overlooked aspects of a successful PCB design. Selecting the right dielectric material and stackup properties to meet the performance characteristics of the design is crucial to the products success. Choosing the incorrect material can lead to excessive electromagnetic emissions, crosstalk, and other signal integrity issues. Selecting the correct materials and stackup can help
Feb 22, 20223 min read


Manufacturing 4.0 Made Possible
By: Deb Geiger, VP Global Marketing, Aegis Software COVID-19 and the workforce shortage combined with increased personalization and...
Feb 8, 20224 min read


MaxLinear and Calibre RealTime Digital: Signoff DRC in P&R
Place and route (P&R) engineers at MaxLinear strive to achieve high reliability and manufacturability in their SoC designs, while also...
Jan 25, 20221 min read


Siemens collaborates with UMC on design kits for automotive and power applications
Siemens has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs) for the foundry‘s 110-nanometer (nm) and 180-nm BCD technology platforms. Siemens Digital Industries Software today announced it has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs) for the foundry‘s 110-nanometer (nm) and 180-nm BCD technology platforms. The new PDKs for UMC, which is a leading semiconductor foundry fo
Jan 24, 20222 min read


恩萊特科技2022新春服務公告
感謝您對恩萊特科技的支持與愛護,農曆新年將至,春節期間營業時間調整如下: 春節假期:2022年1月28日(五)~2月06日(日) 開工日期:2022年2月07日(一) 連假期間如您有任何需求,歡迎多加利用下列資訊: 聯繫表單:https://www.enlight-tec....
Jan 24, 20221 min read


The First Ultra-Secure, IIoT-based Smart Factory Achieved by Lockheed Martin, with IPC-CFX and Aegis
The IPC-CFX IIoT-based, “Plug and Play” Standard is Successfully Utilized, Together with Aegis’ FactoryLogix MES Platform, Across All Key...
Jan 18, 20223 min read


Creating Custom Automation in Valor NPI Using Scripting Languages
Over the years, automation has evolved from the C-Shell, to Perl and now Python as the wizardry world has recently slithered into Valor NPI . We use automation to take on tasks that are overly complex to simply repetitive. With a little experience creating automation for Valor NPI is incredibly rewarding. Whether the development requirement is an hour long, a few days or even weeks, the basic understanding is exactly the same. Test drive Valor NPI for 30 days>> The first step
Jan 11, 20223 min read
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