Siemens EDA IC 全流程 Siemens EDA 全流程有一個豐富的環境，高度可配置且非常靈活，為混合信號設計人員提供了許多易用功能。該流程經過優化，適用於創建 22nm 的定制模擬 IC 或 “類比為頂層” 的混合訊號 IC。它包含高度集成的前端和後端工具，從原理圖輸入到混合訊號模擬和波形檢索、查看及 RTL 網表綜合，再到佈局佈線、物理版圖實現以及晶圓廠認證的 Calibre® 平臺物理驗證。透過集成協力廠商工具支援互通性、多用戶和版本控制的Open Access 資料格式管控。該全流程套件有一個庫管理器，其為管理和流覽所有設計庫、單元和視圖提供一個統一的介面，並且提供對 IC Manage、Cliosoft 和 SubVersion (SVN) 版本控制軟體的支援。 工藝設計套件 (PDK) 是模擬和定制設計環境的一個重要組成部分，包括 OA 資料、CDF、回檔、網表程式和參數化單元 (PCell)。Siemens EDA 工藝包可以由協力廠商PDK轉換而來，包括回檔和 PCell 代碼。可擴展的自動化質檢流程可以確保Sieme

Improved Handling of Array Creation and Spacing in L-Edit Using Alignment Operations Tile2DArray icon now controls rows/columns when all...

By Srinivas Velivala Place and route (P&R) engineers are always on the lookout for ways to optimize their design flows to ensure designs...

By Pradeep Thiagarajan Having done IC development for over two decades, I can appreciate the complexities of foundry processes that influence device modeling and silicon fabrication. Semiconductor physics continues to get pushed to newer limits with each technology progression to a smaller process geometry to achieve better PPA (Power/Performance/Area). Chip developers are packing in more features to enhance the customer experience of the end product with focus on quality and

Introduction The adoption of high-density advanced packaging (HDAP) continues to grow for all kinds of end-user applications. 2.5D integrated circuit (IC) designs using interposers (silicon or organic) generally target high-end applications such as military, aerospace, and high-demand computing, while 3D fan-out packaging approaches like the TSMC integrated fan-out (InFO) package focus more on mass consumption consumer applications like cell phones (figure 1). In addition, al

Place and route (P&R) engineers at MaxLinear strive to achieve high reliability and manufacturability in their SoC designs, while also...

Siemens has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs) for the foundry‘s 110-nanometer (nm) and 180-nm BCD technology platforms. Siemens Digital Industries Software today announced it has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs) for the foundry‘s 110-nanometer (nm) and 180-nm BCD technology platforms. The new PDKs for UMC, which is a leading semiconductor foundry fo

As electronic design companies are investing more in automotive and safety-critical designs, there is a renewed focus on design...

By James Paris A few years ago, I came across some plans to build a simple bookshelf that would fit perfectly in my home. I already had...