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What’s New in Tanner Tools v2021.2?
Improved Handling of Array Creation and Spacing in L-Edit Using Alignment Operations Tile2DArray icon now controls rows/columns when all...
Apr 11, 20223 min read


PADS 應用系列|多路高速佈線設計選項
概述 多路佈線同時遵守板級別的現實限制是PCB設計者在設計基於匯流排或通道的設計時面臨的重大挑戰,同時設計逐漸變得更受限於消除信號完整性方面的問題。設計可能有幾百甚至幾千設計規則,比如最大或最小長度,匹配長度和差分對,所有的這些讓佈局佈線更複雜。讓每一路互動式地佈線是極其耗時的,並在項目交付期限快到時增加很大的壓力。 PADS透過強大的簡單易用的多路高速佈線設計的能力幫助設計者解決這些挑戰。根據設計者定義的規則對PCB設計選擇和完成多路佈線設計,可以選擇幾路也可以選擇很多路想完成的佈線設計。 主要特點: 對於長度匹配、差分對和網路的最小/最大長度提供極佳的控制 按規則分層次地準確地簡單地給任何長度受限的網路佈線 管理和高速線路相關的一些約束 允許簡單地設置和保護網路拓撲結構 説明控制信號偏移和其他的雜訊消除效應 對於差分對佈線提供一個選擇陣列 支援 class-to-class、pair-to-pair 及 pair-to-other 在 layout 的優先設置 為了準確預測完成的佈線路徑包含了五個過孔插入模式 對於增加的 copper 長度提
Apr 6, 20222 min read


Learn the secret to generating signoff fill in P&R and accelerating your tapeouts
By Srinivas Velivala Place and route (P&R) engineers are always on the lookout for ways to optimize their design flows to ensure designs...
Apr 5, 20222 min read


A Powerful Analog Verification Platform for Samsung Foundry’s Advanced Technologies
By Pradeep Thiagarajan Having done IC development for over two decades, I can appreciate the complexities of foundry processes that influence device modeling and silicon fabrication. Semiconductor physics continues to get pushed to newer limits with each technology progression to a smaller process geometry to achieve better PPA (Power/Performance/Area). Chip developers are packing in more features to enhance the customer experience of the end product with focus on quality and
Mar 29, 20224 min read


SMTNW Selects Aegis’ FactoryLogix IIoT-Based Manufacturing Operations Platform
HORSHAM, PA (February 1, 2022) Aegis Software, a global provider of Manufacturing Operations Management Software (MOM/MES), announces...
Mar 22, 20223 min read


Taking 2.5D/3DIC physical verification to the next level
Introduction The adoption of high-density advanced packaging (HDAP) continues to grow for all kinds of end-user applications. 2.5D integrated circuit (IC) designs using interposers (silicon or organic) generally target high-end applications such as military, aerospace, and high-demand computing, while 3D fan-out packaging approaches like the TSMC integrated fan-out (InFO) package focus more on mass consumption consumer applications like cell phones (figure 1). In addition, al
Mar 8, 20228 min read


Enhancing Resiliency in Manufacturing through Connected Platforms, Increased Visibility, and Process
By: Deb Geiger, VP Global Marketing, Aegis Software When it comes to manufacturing digitalization, many organizations know what they need...
Mar 1, 20224 min read


How do you do PCB Stackup Planning?
By Don Kost Planning for Signal Integrity Stackup planning is one of the most important but often overlooked aspects of a successful PCB design. Selecting the right dielectric material and stackup properties to meet the performance characteristics of the design is crucial to the products success. Choosing the incorrect material can lead to excessive electromagnetic emissions, crosstalk, and other signal integrity issues. Selecting the correct materials and stackup can help
Feb 22, 20223 min read


Manufacturing 4.0 Made Possible
By: Deb Geiger, VP Global Marketing, Aegis Software COVID-19 and the workforce shortage combined with increased personalization and...
Feb 8, 20224 min read
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