By Don Kost Planning for Signal Integrity Stackup planning is one of the most important but often overlooked aspects of a successful PCB design. Selecting the right dielectric material and stackup properties to meet the performance characteristics of the design is crucial to the products success. Choosing the incorrect material can lead to excessive electromagnetic emissions, crosstalk, and other signal integrity issues. Selecting the correct materials and stackup can help

By: Deb Geiger, VP Global Marketing, Aegis Software COVID-19 and the workforce shortage combined with increased personalization and...

Place and route (P&R) engineers at MaxLinear strive to achieve high reliability and manufacturability in their SoC designs, while also...

Siemens has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs) for the foundry‘s 110-nanometer (nm) and 180-nm BCD technology platforms. Siemens Digital Industries Software today announced it has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs) for the foundry‘s 110-nanometer (nm) and 180-nm BCD technology platforms. The new PDKs for UMC, which is a leading semiconductor foundry fo

感謝您對恩萊特科技的支持與愛護，農曆新年將至，春節期間營業時間調整如下： 春節假期：2022年1月28日(五)~2月06日(日) 開工日期：2022年2月07日(一) 連假期間如您有任何需求，歡迎多加利用下列資訊： 聯繫表單：https://www.enlight-tec....

The IPC-CFX IIoT-based, “Plug and Play” Standard is Successfully Utilized, Together with Aegis’ FactoryLogix MES Platform, Across All Key...

Over the years, automation has evolved from the C-Shell, to Perl and now Python as the wizardry world has recently slithered into Valor NPI . We use automation to take on tasks that are overly complex to simply repetitive. With a little experience creating automation for Valor NPI is incredibly rewarding. Whether the development requirement is an hour long, a few days or even weeks, the basic understanding is exactly the same. Test drive Valor NPI for 30 days>> The first step

As electronic design companies are investing more in automotive and safety-critical designs, there is a renewed focus on design...

恩萊特科技於2021年12月7日舉辦「Moore and More 後摩爾時代 - 半導體關鍵技術研討會」，由學界、業界專家分享目前最新的半導體趨勢與發展，從異質整合、微機電感測器、EDA、HPC，到化合物半導體，邀您共同重溫恩萊特年會精彩每一幕。...